Silicon Carbide in Semiconductor Applications
Overview
High-purity silicon carbide (SiC) powders are widely used in semiconductor manufacturing. Their sharp edges and chemical stability make them ideal for wafer planarization, CMP (chemical mechanical polishing), and substrate preparation for chips and electronic devices.
SiC ensures precise material removal, low contamination, and consistent surface quality, which are critical for modern electronics and microelectronics industries.
Application Scenarios
- Wafer Planarization: Smooths silicon and compound semiconductor wafers before device fabrication.
- CMP Slurries: Enhances chemical mechanical polishing efficiency for microelectronics.
- Substrate Preparation: Prepares ceramic, silicon, and glass substrates with high precision.
- Semiconductor Component Finishing: Achieves low roughness and uniform surface for advanced ICs and MEMS devices.
Recommended Product & Grit Sizes / Grades
Ultra-fine green silicon carbide powders are typically used for semiconductor wafers and CMP applications. Grit size selection depends on the required flatness and surface finish.
| Application Type | Recommended Product | Typical Grit Size |
|---|---|---|
| Wafer planarization | Green SiC Powder (Ultra-fine) | 0.5μm – 3μm |
| CMP & polishing | Green SiC Powder | 0.1μm – 2μm |
| Substrate preparation | Green SiC Powder | 0.5μm – 5μm |
Related Applications
Sandblasting
Bonded Abrasives
Glass Sandblasting
Optical Glass
Superfinishing Stone